Dice

Blade to dice

I cut a wafer in so to dice integrated circuits formed on the wafer of the semiconductor and cut and bring it down, and (English: dicing or die cutting) to dice is a process to chip.

You cut an integrated circuit formed on the wafer without confusion and must assume it one tip. Call "the margin" to establish between a pattern and the patterns on the wafer with spacing (spacing) or a scribe line (scribe line) and is almost less than 100μm. High precision is demanded to use the wafer without waste, and to be connected directly with profit again so as to be small if width to scrape off is narrow so as to be high if processing precision is high.

Of the wide sense, in dicing it, often include the scribe. Of the narrow sense point to the process itself of the cutting, and let a blade (mainstream a circular rotary blade made of diamond) to dice rotate at high peed, and dicing it cuts it while performing a wash-off of cooling, the cutting waste in pure water.

Representative device maker

• Disco
• TOKYO SEIMITSU

References

• Hiroshi Aida "five chapters" "autobiography conclusion Japan broadcast publication association of NHK electron nation Japan", 1992. ISBN 4-14-080019-4。

Allied item

• The autobiography sixth of electron nation Japan
• So to dice

This item is an unfinished item in conjunction with engineering, the technique. I demand the cooperator who corrects it, and corrects this item.

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