2017년 5월 30일 화요일

Wafer

Wafer

Various wafers
The silicon wafer which it was processed etching into. It is a principle same as CDs with a structure color origin to shine in rainbow color

Wafer [1], wafer [2], wafer [3], wafer [4], wafer [5], wafer [6] [7] (British: wafer) are materials of the semiconductor element production. It is the discal board which sliced a columnar ingot made with material such as the single crystal silicon which managed the composition highly thinly. The name comes from the wafer of the confectionery.

Table of contents

Shape

I enlarge it in diameter with a year that there are some diameter of wafer to 50mm -300mm and can cut and bring down many integrated circuit chips from one piece of wafer if this diameter is big. A silicon wafer of 300mm in diameter was put to practical use from about 2000 and occupied approximately 20% of the silicon wafer production amount in 2004.

I am made from convenience of the handling in the process of manufacture to 0.5mm around -1mm, and, in the case of a general silicon wafer, the outside size is standardized in trade group such as SEMI (English version), and, in the case of 150mm in diameter (6 inches), the thickness of the wafer is done with thickness 0.775mm at thickness 0.725mm, 300mm (12 inches) at thickness 0.625mm, 200mm (8 inches). The thickness clearance is +-0.025mm.

The straight line part called the orientation flat [8] or a notch called a notch is established on the lap to merge the direction of the wafer during a process. In addition, the wafer is sliced along specific crystallographic orientation so that it is, and a notch position of cage Fra is fixed at a direction most suitable for the operation of the semiconductor element which crystal structure produces by conductive model and crystallographic orientation.

Kind

Main maker

Source

This article is taken from the Japanese Wikipedia Wafer

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